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| Item: | Black 6 Inch 0.2mm Thickness Lithium Tantalate Wafer For SAW Use | Material: | Lithium Tantalate (LiTaO3 |
|---|---|---|---|
| Diameter: | 4inch,6inch | Thinckness: | 0.2mm,0.35mm,0.5mm |
| Refractive Indices: | No=2.176,ne=2.180(at 0.633 µm) No=2.131,ne=2.134(at 1.2 µm) | Orientation: | X-112°Y,36°Y,42°Y±0.5 |
| Curie Temperature: | 607℃ | Optical Homogeneity: | ~10-5 |
| Highlight: | 0.2mm Lithium Tantalate Wafer,6 Inch Lithium Tantalate Wafer,SAW Use LiTaO3 Wafer |
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Black 6 Inch 0.2mm Thickness Lithium Tantalate Wafer For SAW Use
LiTaO3 Lithium Tantalate (LT) crystal is an important multifunctional crystal material with excellent piezoelectric, ferro-electric, acoustic-optical and electro-opticaleffects.Therefore, it has become a basic functional material in the field of acoustic surface wave (SAW) devices, optical communication, laser, and opto-electronics. Polished LT wafer is widely used in the manufacturing of resonators, filters,transducers and other electronic communication devices, especially for its good mechanical and electrical coupling,temperature coefficient and other comprehensive performance and is used in manufacturing high-frequency acoustic ,surface wave devices, and applied in many mobile phones, intercom, satellite communication, aerospace and other communication fields.
Basic Properties of LiTaO3:
| Crystal Structure | Trigonal |
| Lattice constant | a=5.154Å,c=13.783Å |
| Density | 7.45g/cm3 |
| Melting Point | 1650℃ |
| Curie Point | 603±2℃ |
| Mohs Hardness | 5.5-6 Mohs |
| Dielectric Constant | es11/eo:39~43, es33/eo:42~43；et11/eo:51~54, et33/eo:43~46 |
| Thermal Conductivity | 1015wm |
| Thermal Expansion Coefficient | a1=a2=1.61×10-6/℃, a3=4.1×10-6/℃ |
| Refractive Indices | n0=2.176 ne=2.180 @ 633mn |
| E-O Coefficient | R33=30.4 |
| Electro-mechanical coupling factor | R15≥0.3 |
| pyroelectric coefficient | 2.3×10-7 C/cm2/K |
| transmission range | 400-5000nm |
Typical Specifications:
| Size | Boule or wafer ,Acoustic or Optical grade |
| Doping | Fe, No Doping or With Fe |
| Boule Length | ≥50mm |
| Wafer Thickness | 0.25,0.35,0.50(mm) |
| Orientation | Y42°/Y36°/X/Y/Z or Upon Request |
| Surface Process | Single/Double Sides Polishing |
| TTV | < 10μm |
| BOW | BOW ± (25μm ~40um ) |
| Warp | ≤35μm |
| Flat Width | 32.0±2.0(mm) or Upon Request |
| Roughness | Ra≤10Å |
| Chamfe | ≤0.1mm@45° |
Contact Person: Ms. Wu
Tel: 86-18405657612
Fax: 86-0551-63840588
